Top Executives to Discuss Challenges of Cloud and B2B Integration in Today’s Complex IT Environment
ATLANTA, GA – May 6, 2013
Liaison Technologies, a global provider of secure cloud-based integration and data management services and solutions, announced today that it is sponsoring the Ariba LIVE conference in Washington, DC, taking place May 6th through 8th, 2013 at the Gaylord National Resort & Convention Center. The Ariba LIVE conference, which brings together industry influencers, customers and partners, also offers Liaison the opportunity to engage with leading buyers, industry analysts, and other experts and influencers.
During the LIVE conference, Liaison executives will be on hand to offer insight into today’s emerging B2B and cloud integration challenges, and discuss the growing role of Cloud Services Brokerage in accelerating the adoption and integration of in-demand SaaS-based eCommerce solutions like Ariba Network.
Ariba has been part of the Liaison SaaS partner program since August 2012, when Liaison acquired Hubspan, a provider of cloud integration services and an Ariba partner since 2010. Through its partnership with Liaison, Ariba offers streamlined integration of its leading cloud-based B2B ecommerce solutions to its base of enterprise customers across the globe.
Liaison Technologies is a global data management and integration company. It provides innovative solutions to integrate, transform, harmonize, manage and secure critical business data on-premise or in the cloud. With a comprehensive array of business-to-business and application-to-application integration and data transformation services, as well as on-premise and cloud-based data security solutions, Liaison’s practitioners implement data management infrastructures adapted to each client’s specific business requirements. Headquartered in Atlanta, Liaison has offices in the Netherlands, Finland, Sweden and the United Kingdom. For more information, visit www.liaison.com.
Liaison and the Liaison logo are trademarks of Liaison Technologies, Inc. All other names or product names mentioned in this release are trademarks or registered trademarks of their respective companies.